SQ capillary coupled with optimized bonding parameters, has proven to deliver an increase in the capillary tool life as lower bond force (BF) is utilized to bond the QFN package. Proven Reliability. Whether on gold or copper wire, the SQ capillary is designed to enhance the formation of larger & width stitch bond that will effectively increase

Latest capillary solution for copper wire bonding Quantis™ QFN is the first in the Quantis family of copper wire bonding capillary products based on our latest and most advanced ceramics composite platform. This new capillary combines our extensive copper wire applications experience with the innovatively engineered geometrical designs produced to handle the toughest process challenges on a

Wire Bonding Material Wire bonding materials used in a ball bonding process mainly include the bonding wire and bonding tool. Ball bonding tools are called capillaries, which are axial-symmetric ceramic tools with vertical feed holes. Figure 2 shows an example of a capillary used in fine-pitch applications.

Capillary Cleaning. LD Microprecision has developed the ultra fine probes that is used in the wafer testing to effectively clean the smallest capillary wire drag holes. We have carried out some development to recycle the used Wire Bond capillary to extend its lifespan by at least 75-100% depending on the touch down usage. Obviously, even at the

This study focus on five different capillaries with same tip design, namely of three standard design capillaries with different main taper angle (MTA) and two 

Use wire bonding capillary to fill paint cans with speed and precision. Other compatible fluids include resin or glue, making such devices suitable for 

Wire Bonding Capillary (Capillaries) For Reference Only Please contact the capillary manufacturer directly for more information. Listed Alphabetically: Type: Address : Contact: Ball & Wedge: CoorsTek Gaiser Precison Tools 4544 McGrath Street Ventura, CA 93003 USA: Tel: +1-805-644-5583 www.gaisertool.com:

A multiple face angle wire bonding capillary of the present invention has an elongated hole therethrough terminating at one end of the capillary tip, 

14/11/  · SOLUTION: A capillary for wire bonding has a tip portion 1 tapered toward the tip and at least the tip portion 1 includes alumina as the main component and zirconia as a sub-component. The capillary comprises a alumina-quality sintered body which has flexural strength higher than 700 MPa, Young's modulus higher than 380 GPa and Vickers hardness

the selection of capillary part number process is simplified as follows: capillary tip the selection of capillary tip design is determined by the device and metallization, bond pad pitch, bond pad opening, wire size, target mashed ball diameter, and critical loop height to derive the hole diameter (hd), chamfer diameter (cd), chamfer angle (ca),

Wirebonding equipment use bonding tools known as capillaries for thermosonic ball bonding. Capillaries hold and control the bonding wire as well as form bonds from it during the ball bonding process. Capillaries are ceramic axial-symmetric tools with vertical feedholes (holes where the bonding wires are fed) through its center. Fig. 1.