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Bonding with TPT's automatic Wire Bonder HB100: Pattern Recognition and automatic bonding a series of chips on different substrates. One Bond Head. for Wedge, Ball, Big or unusual substrates and cases will have more then enough space on our HB100. Even better, combine it with one of our larger heater stages. Heaterstages. 04_02_Heiztische

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The HB100 is a new generation of automatic desktop wire bonders. It is suited for laboratories and small volume production lines. One bond head for bonding in ball/wedge or wedge/wedge bonding mode. Z- X- & Y-Axis are fully automatic/motorised. The HB100 is very easy to handle with the touchscreen and joystick.