ITEM DETAILS Product Name Wire Bonder Model UTC-5000NeoCu Super Bonding Accuracy ±2.0 μm（3σ）Using Shinkawa standard device Correction of Bonding Position System to check and correct capillary offset prior to

The wirebonder is designed for ultrasonic, thermosonic, or thermocompression wedge bonding of IC's, hybrids, microwave devices, and laser diodes using gold 

2022/08/08 · WIRE BONDER for the development and production of microchips and DIE BONDER for placing microchips. Wire Bonder HB05 HB10 HB16 HB100 HB30 Overview Die

A wire bonder is a machine that performs operations according to the process requirements. There are several wire bonders available according to the type of bonding, modes, and operation. These machines can be manual, automatic, and semi-automatic as per the requirement. Wire bonding machine. A manual wire bonding machine is used for wedge

Hesse's latest generation of fully automatic wire bonders offer advanced ultrasonic bonding technologies for fine wire and heavy wire bonding applications.

05/27 · Thanks to years of experience and proven technologies, the wire bonders of F&S Bondtec are always able to meet the high demands of its customers. For many years, the company has been characterized by its innovative strength and customer orientation. The wire bonders from F&S Bondtec offer the best quality and an unbeatable price-performance ratio.

A process safe, all-in-one bonder for any demanding wire bonding process, particularly suitable for ball-wedge bonding in packages (deep access). Read more. F & 

Automatic Wire Bonders ESEC 3100 Ball-Wedge Bonder Specifications Ultrasonic frequency: 130 kHz Flying bondhead Fixed electrode (EFO currents upto 400 mA) 

The Bondjet BJ855 is the latest generation of fully automated fine wire bonders and expands the existing product portfolio of fine wire bonders. The Bondjet BJ855 is characterized by the following features: Software features for the growing demand of connectivity and industry 4.0 (e.g. Hesse Bonder Network, remote control of PR, improved MES

The West Bond Wire Bonder is a semi-automatic wire bonder that can accommodate both wedge and ball bonding to interconnect aluminum or gold wire leads to devices. Three ultrasonic bonding methods can be executed; wedge bonding with angled wire feed for best loop control, wedge bonding with vertical feed for access to deep workpieces, selected

Wire bonders are used to make several package types. Each package has a different number of bond wires with various wire lengths, loops, and